WEBVTT

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Hello, my name is Nathan
Dostart.

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I am an Electro optic engineer
at NASA Langley Research Center.

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My background is in Integrated
photonics which I which I worked

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on during grad school,
particularly in Silicon

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photonics for optical
communications and Lidar at 5050

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nanometers and since coming to
NASA, I've expanded that to

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include quite a few more
platforms, wavelengths, and

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applications.

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The core objective of the
subtopic is to develop new PIC

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technology, new PIC capabilities
and by that I mean a variety of

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things including devices, new
platforms, new integration

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techniques, new packaging
techniques really expanding the

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scope of what can be done on a
PIC and especially what can be

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done on a single PIC including
integration.

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And the the overarching goal is
really having is is being able

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to have a technology such that
anytime I want to develop a new

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pick at a specific at some
wavelength I can go to one place

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ideally and and fabricate and or
and or integrate a pick that has

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all the all the core
capabilities.

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You know so lazing, amplifying,
modulating and detecting and and

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so that that's the kind of
capability we're trying to to

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develop.

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So I want to clarify that how we
kind of draw the line between

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this PIC subtopic and say other
subtopic such as that I would

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call more application
application based.

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I'll use LIDAR as an example.

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So if you were to develop a a
PIC LIDAR and the question and

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that's what you're going to
propose, the question is would

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you submit it to this subtopic
or to the LIDAR subtopic.

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And and the the line that we are
roughly roughly using is, is if

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you if you're really focusing,
if you're taking the pick and

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you're integrating it into a
bigger system and so therefore

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the the proposal's really about
the bigger system that's that's

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probably makes more sense to go
to that system level subtopic.

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However if you're if you're
focused on the pick itself and

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you're probably developing some
kind of new capability with the

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pick that's that's really that's
really of interest for for this

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subtopic.

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So for critical gaps there's
obviously a lot of things to be

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done.

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So I'm just going to focus on
the ones that are most

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interesting to NASA right now.

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We do need high speed
modulation, let's say better

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than 40, better than 20
gigahertz ideally more than 40

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gigahertz with low V π at any
wavelength.

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We need to good photo detectors
and phase shifters at visible in

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the IR wavelengths.

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Photo detectors might be analog,
you know pin style or they might

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be Apds but detect high
responsive detectors and

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invisible they are are very
interesting right now we need

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improved fiber to chip coupling,
ideally something better than

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one DB fiber fiber to waveguide.

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Right now what we've been able
to achieve is typically two to

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three DB at telecom wavelengths.

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So anything that allows you to
to efficiently couple from

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single mode fiber to high index
contrast waveguides better than

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let's say better than two DB is
is very interesting to us.

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We are also interested in new
packaging techniques, anything

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that allows packages to be more
robust, maybe smaller, more

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compact, better integrated with
electronics.

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Then then say a kind of a
butterfly style package are

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certainly interesting.

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Successful implementation of one
of these proposals for NASA

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maybe maybe looks a little bit
different than than in some

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other areas.

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For us, especially if you're
developing say a new a new

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technique or a new component,
the question is how do we best

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integrate that with maybe you
know, maybe something we already

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have.

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So I'll I'll take that as an
example.

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If you developed say a new
modulator, do I have to, maybe I

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already have let's say a PIC
process that I've set up.

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I have a foundry and I and I go
without any of that person's

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doing my my fabrication and I
have packaging set up and I've

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kind of got a, let's say a
supply chain for this PIC.

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Do I have to leave that supply
chain to to use your new

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modulator or or is there a
chance that we could take this

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new modulator and put it put it
in the foundry that I'm using

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right now.

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So I I don't think there's a
right and wrong answer here, but

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I, I want people who propose to
this topic to consider how

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someone would use it because
obviously unlike say fiber

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optics, I can't go by your
modulator and go just stick it

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with you know couple it to my
pick, right.

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They to really get the full
benefit they have to be in the

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same platform or or some kind of
some kind of way to integrate

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them together.

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So successful proposals will I
think include a a relatively

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clear plan on how this component
could be combined or used or

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whatever new technology
developed could be combined with

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say an existing an existing
platform process you know

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workflow that NASA might already
have.

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So whether it's integrating it
with the foundry or whether

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you're going to be an extra step
in the supply chain where you

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say, hey send your PIC to us and
we do our thing and then we send

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it back to you.

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So kind of understanding that it
needs to fit with an existing

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supply chain ideally and a plan
to how to best do that is the

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best way to be successful for
this.

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Broader impacts are are probably
pretty clear for for many people

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in the photonic integrated
circuit field.

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Obviously Datacom was was one of
the major drivers and continues

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to be so.

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So I hope that whatever we
develop here for NASA interest

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especially when it comes to
let's say integration or

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packaging can can be applied
across all all fields of

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interest.

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Obviously telecom, telecom type
wavelength developments can be

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directly applied for telecom as
well as automotive Lidar whereas

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I believe visible and the IR
developments are very useful for

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life sciences and health
monitoring applications of PIX.