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Press Release 97-22

Sally V. Harrington
NASA Lewis Research Center
(Bus: 216/433-2037)


CLEVELAND, OH-- NASA Lewis Research Center has signed a $12.3 million, three-year, cost-shared cooperative agreement with COM DEV International Ltd., Cambridge, Ontario, Canada; E. I. Dupont, Inc., Wilmington, DE; and Lockheed Martin Missiles and Space Company, Palo Alto, CA, and Lockheed Martin Communications and Research Center, Princeton, NJ.

The agreement is to develop satellite communication payloads using high temperature superconductors (HTS) and to demonstrate their use to be cost effective and an enhancement to the performance of current communication systems. Funding was provided by the Technology Reinvestment Program through the Defense Applied Research Project Agency (DARPA).

As Phase II of an original agreement to develop the technology for high power HTS microwave components, this agreement will demonstrate the feasibility of the HTS subsystems in space communication satellites. Additionally, the developed payloads will demonstrate an improvement in performance, size, and weight over conventional satellite components.

The responsibility for the agreement is divided among the partners. NASA Lewis will manage and monitor the agreement, provide technical direction, and divide the overall scope of the subsystems. COM DEV is responsible for the overall industrial program management of the agreement and the microwave components and subsystems development.

Dupont is responsible for the HTS microwave devices, packaging and design to be used. Lockheed-Martin Missile and Space is responsible for the development and manufacturing of a high-efficiency cryocooler. Lockheed-Martin Communications and Research Center is responsible for system analysis, subsystem selection integration of satellite activities and testing of the integrated subsystem for space worthiness.

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Information about other satellite communications programs is available from the Communications Technology Division.


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